Category:Chip carriers

From Wikipedia, the free encyclopedia

Pertains to the non-conducting packages that are used to provide larger, more robust assemblies for integrated circuit chips that are then soldered to circuit boards.

See the main article: Chip carrier.

Pages in category "Chip carriers"

The following 50 pages are in this category, out of 50 total. Updates to this list can occasionally be delayed for a few days.

  • Chip scale package
  • Chip carrier

B

  • BGA1
  • BGA2
  • Ball grid array

C

  • CPGA
  • Ceramic ball grid array
  • Cerquad

D

  • Die attachment
  • Dual Flat No Lead
  • Dual in-line package

F

  • Flat pack
  • Flip chip
  • Flip-chip pin grid array

H

  • HVQFN

I

  • Integrated circuit encapsulation

I cont.

  • Integrated circuit packaging

L

  • LQFP
  • Land grid array
  • Leadless chip carrier
  • List of chip carriers
  • Low insertion force

M

  • Micro Leadframe Package
  • Micro-FCBGA
  • MicroLeadFrame
  • Mini-Cartridge
  • Multi-Chip Module

O

  • OPGA

P

  • PQFP
  • Package on package
  • Pin grid array
  • Plastic leaded chip carrier

Q

  • QFN

Q cont.

  • QFP
  • Quadruple in-line package

R

  • ROM cartridge

S

  • Shrink Small-Outline Package
  • Single in-line package
  • Small-outline integrated circuit
  • Staggered Pin Grid Array
  • Surface-mount technology

T

  • TO220
  • TO3
  • TO92
  • TQFP
  • TSSOP
  • Thin small-outline package
  • Through-hole technology

U

  • UICC

Z

  • Zig-zag in-line package
Categories: Integrated circuits | Packaging (microfabrication)
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