Shrink Small-Outline Package
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Shrink small-outline package (SSOP) is a microchip package for surface-mount technology. SSOP chips have "gull wing" leads protruding from the two long sides, and a lead spacing of 0.025 inches (0.635mm).
[edit] See also
- Plastic Small-Outline Package (PSOP)
- Thin Small-Outline Package (TSOP)
- Thin-Shrink Small Outline Package (TSSOP)
[edit] External Link
- Image of a 74HC4067 multiplexer chip in a SSOP package. A US quarter is shown for a size reference.
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