Quadruple in-line package

From Wikipedia, the free encyclopedia

This article does not cite any references or sources. (March 2007) Please help improve this article by adding citations to reliable sources. Unverifiable material may be challenged and removed.

In microelectronics, a quadruple in-line package (QIP), sometimes called a QIL package, is an electronic device package with a rectangular housing and two parallel rows of another two parallel rows of electrical connecting pins.