Vanadium(III) nitride
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| Vanadium(III) nitride | |
|---|---|
| IUPAC name | Vanadium(III) nitride |
| Other names | vanadium nitride |
| Identifiers | |
| CAS number | [24646-85-3] |
| Properties | |
| Molecular formula | VN |
| Molar mass | 64.948 g/mol |
| Appearance | black powder |
| Density | 6.13 g/cm3 |
| Melting point |
2050 °C |
| Boiling point |
°C |
| Except where noted otherwise, data are given for materials in their standard state (at 25 °C, 100 kPa) Infobox disclaimer and references |
|
Vanadium(III) nitride, VN, is a chemical compound of vanadium and nitrogen. Vanadium(III) nitride is formed during the nitriding of steel and increases wear resistance. [1] Another phase, V2N, also referred to as vanadium nitride, can be formed along with VN during nitriding. [2] VN has a cubic, rock salt structure. There is also a low temperature form which contains V4 clusters [3] It is a strong-coupled superconductor. [4]
Nanocrystalline vanadium nitride has been claimed to have potential for use in supercapacitors [5]
[edit] See also
[edit] General References
[edit] Footnotes
- ^ Study of the wear behavior of ion nitrided steels with different vanadium contents R.M. Muñoz Riofanoa, L.C. Castelettia, and P.A.P. Nascenteb Surface and Coatings Technology 200, Issues 20-21,(2006), 6101 doi:10.1016/j.surfcoat.2005.09.026
- ^ Thermo reactive diffusion vanadium nitride coatings on AISI 1020 steel U.Sen Key Engineering Materials vols 264-268 (2004),577
- ^ Structural phase transition at 205oK in stoichiometric vanadium nitride Kubel, F., Lengauer, W.’ Yvon, K., Knorr, K., Junod, A. Physical Review B (Condensed Matter), Vol 38, 18, (1988), 12908 doi:10.1103/PhysRevB.38.12908
- ^ Superconducting and normal-state properties of vanadium nitride B. R. Zhao, L. Chen, and H. L. Luo M. D. Jack D. P. Mullin Phys. Rev. B 29, 6198 - 6202 (1984) DOI: 10.1103/PhysRevB.29.6198
- ^ Fast and Reversible Surface Redox Reaction in Nanocrystalline Vanadium Nitride Supercapacitors D. Choi, G. E. Blomgren, P. N. Kumta Advanced Materials , 18, 9 , 1178 doi: 10.1002/adma.200502471

