Talk:Flip-chip pin grid array

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[edit] SEPP

What does SEPP mean in this article? Please could you add a note to SEPP explaining this and disambiguate the link in the article if you know? Lupin|talk|popups 13:55, 24 September 2005 (UTC)

"the silicon core is facing up and the heat slug is exposed" i think you will find that the core is facing downwards with its contacts against the package. the exposed part is the reverse(substrate) of the core.

dose anybody agree or can anybody suggest an alternative wording

This article is very Intel-centric, with only a couple mentions of AMD or other chip makers. —Preceding unsigned comment added by 71.183.199.83 (talk) 15:06, August 28, 2007 (UTC)

That is because the FC-PGA package was designed by Intel. AMD used the CPGA and OPGA packages. ANDROS¹³³⁷ 15:09, 11 September 2007 (UTC)