Die (integrated circuit)

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A die in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) through processes such as Photolithography. The wafer is cut into many pieces, each containing one copy of the circuit. Each of these pieces is called a die.

There are three commonly used plural forms: dice, dies, and die.

[edit] See also

• Integrated circuit
• Semiconductor fabrication
• Wafer dicing
• Die preparation