Image:Cudeposition.gif
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[edit] Summary
| Description |
Molecular dynamics computer simulation of the deposition of a single copper atom with a kinetic energy of 1 eV on a copper surface. Technical details: cross section of two atom layers in the middle of a larger (10x10x10 unit cells) 3D simulation cell. Simulation made with Sabochick-Lam embedded-atom method potential, Berendsen temperature control used only at the outer boundaries to scale temperature down to 0 K. Initial temperature 0 K (cell prerelaxed to allow for surface relaxation inwards). This kind of processes occur in reality during physical vapour deposition. |
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| Source |
self-made |
| Date |
30.7.2007 |
| Author | |
| Permission (Reusing this image) |
see below |
[edit] Licensing
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I, Knordlun, the copyright holder of this work, hereby release it into the public domain. This applies worldwide. In case this is not legally possible: Afrikaans | Alemannisch | Aragonés | العربية | Asturianu | Български | Català | Česky | Cymraeg | Dansk | Deutsch | Eʋegbe | Ελληνικά | English | Español | Esperanto | Euskara | Estremeñu | فارسی | Français | Galego | 한국어 | हिन्दी | Hrvatski | Ido | Bahasa Indonesia | Íslenska | Italiano | עברית | Kurdî / كوردی | Latina | Lietuvių | Latviešu | Magyar | Македонски | Bahasa Melayu | Nederlands | Norsk (bokmål) | Norsk (nynorsk) | 日本語 | Polski | Português | Ripoarisch | Română | Русский | Shqip | Slovenčina | Slovenščina | Српски / Srpski | Svenska | ไทย | Tagalog | Türkçe | Українська | Tiếng Việt | Walon | 中文(简体) | 中文(繁體) | zh-yue-hant | +/- |
File history
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| Date/Time | Dimensions | User | Comment | |
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| current | 12:39, 30 July 2007 | 320×380 (669 KB) | Knordlun | ({{Information |Description=Molecular dynamics computer simulation of the deposition of a single copper atom on a copper surface. Technical details: cross section of two atom layers in the middle of a larger 3D simulation cell. Simulation made with Sabochi) |
