Image:CPU copper heat sink.jpg
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The construction of this device is covered by several patents, but I think they only apply for manufacturing, not the image of device. Much more detailed description should be found in the patent itself.
Patents: Korean 00-54635, Korean 04-16030, other applications pending.
Photo by Audrius Meskauskas, Audriusa 18:48, 22 January 2006 (UTC)
| I, the creator of this work, hereby grant the permission to copy, distribute and/or modify this document under the terms of the GNU Free Documentation License, Version 1.2 or any later version published by the Free Software Foundation; with no Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts. Subject to disclaimers. |
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| Date/Time | Dimensions | User | Comment | |
|---|---|---|---|---|
| current | 18:43, 22 January 2006 | 1,875×959 (190 KB) | Audriusa | (CPU heat sink with wide fan. By Audrius Meskauskas, ~~~~ {{GFDL-sel}} Category:Electric components) |
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