Talk:Computer cooling

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Someone has created a CPU cooling wikipedia article that is similarly related to this one. I believe that it should be merged with this article, or at least linked to. --Farnkerl 15:44, 5 August 2005 (UTC)

I agree. I'm editing the Computer cooling article to include the info in the CPU cooling article, applied to computer components in general (where appropriate), as much of it applies equally to other components. I'll see how it works out. If it doesn't, I'll just put a link in an appropriate place. --FrostyBytes 18:53, 21 March 2006 (UTC)


May I introduce a new computer cooling concept, Ice-Cooled-Computer-Cooler:

http://www.ice-cooled-computer-cooler.homechoice.co.uk


Suggest someone add a phase change section.

Contents

[edit] merging spot cooling with cpu cooling

I just merged CPU cooling into this article, we need to remove the redundant information.

Well, that was a bit too hasty, in my opinion. Anyway, I've finally merged the CPU section into the article. Additional clean up may be required, I'd appreciate it if someone could check it out, I'm probably too invested in the article to see its flaws. --FrostyBytes 01:00, 15 June 2006 (UTC)

[edit] Computer fan & Computer cooling

I think that computer fan should not be merged with Computer cooling but instead only be listed in short form. Computer fan should be a seperate part from Computer cooling because it is a different thing. For example, although there is a Compressor in the Air conditionig system, but they are seperated article due to Compressor can be written in detail, similar to Computer fan article, and may make the Computer cooling article too long if is merged.Carbonferum 00:46, 27 May 2006 (UTC)



[edit] Heat Sink

Hey, I think the "Heat Sink" article should be merged with this too, it is pitiful by itself and really belongs here... I don't know how to do that though. :(

I currently disagree. Computer cooling is an objective; heat sinks are an object. Each has their place as a separate article. As an analogy, you will find articles on hunting and on arrows. --Charles Gaudette 21:10, 23 June 2006 (UTC)

[edit] Rounded cables

"...but there is no anecdotal evidence of rounding cables reducing performance"

I do not believe this is the correct usage of the word "anecdotal"; the proper word is most likely "empirical". Anecdotal evidence is useless, while empirical evidence has actual value. However, I do not know the author's original intent. Please advise. -- June 2006

[edit] Listing of changes needed

With recent changes, the computer cooling article has seen significant improvement. As of this date, the following modifications would help greatly in improving the article:

--FrostyBytes 01:25, 24 June 2006 (UTC)

Not sure if I am doing this correctly, but the link to Leonard Peltier leads to a Native American activist, not the intended individual. http://en.wikipedia.org/wiki/Leonard_Peltier -Jascal

[edit] heat-pipe section

The heat-pipe-section is very short and old.

It is nor true anymore, that heatpipes are only used for small form factor and silent cooling. AMD even uses heat-pipe coolers as boxed coolers for its high end Athlon 64 X2 models (I think X2 4800+ and upwards).

Also I think it should be mentioned, if it is a problem, when you install heatpipe-cooler motherboards upside-down, which must be done in some cases like this one.

[edit] H2Ceramic cooling

H2C (for short) is added as a hybrid spot cooling technique that mixes thermoelectric and liquid cooling, along with temperature sensors and control logic to manage fan and pump speed and TEC voltage to prevent frost and humidity condensation. Dell invented H2C and is the first company to use this technology. A short article on H2C links to related materials, including Dell's technical paper. I tried to write the article without marketing hype and keep it neutral, but mentioning Dell is a must so people know where to find additional info.

-Wcaswell

Liquid Cooled Peltier devices are nothing new, nor is electronic temperature regulation. H2C just sounds like another out-of-the-box extreme cooling product. --711groove 13:46, 21 March 2007 (UTC)


[edit] Toms hardware guide link

The link to Toms hardware guide gives a 404 error. —The preceding unsigned comment was added by 83.70.48.143 (talk) 16:29, 4 February 2007 (UTC).

[edit] Lapping

The article fails to mention IHS lapping, this should be mentioned in the lapping section, as it is equally, if not more common than heatsink lapping among overclockers. --711groove 13:46, 21 March 2007 (UTC)

[edit] Effect on thermal grease

It is also worth noting that as the surface gets smoother, there is less and less ability for TIMs (such as thermal grease, or a standard thermal pad) to fill microscopic gaps from thermal expansion, thereby reducing over-all effectiveness of such materials and in some cases inhibiting thermal transfer.

Is that actually a concern? It seems to me that making the surface smoother implies a reduction of those microscopic gaps, and thus a smaller amount of thermal grease is necessary -- if the grease particles have no gaps to cling to, so much the better. VanishingUser 03:50, 8 April 2007 (UTC)

Wow. Talk about misunderstanding. ok. a few theory basics then the application. The most efficent heat transfer due to conduction between adjacent atoms. Diffrent atoms form diffrent pure lattus structures which conduct heat at diffrent rates. ( The nunber of free electrons helps, so good electical conductors become good heat conductors ). The distance between the nuculi ( or density of the material ) influnces it also. Pure copper is a great heat conductor, but soft, so a tiny bit of impurity is added to gain strength, while maintaining the thermal conductive properties. But when you want to transfer heat away from metal wires in glass you have an interface that has a gap. You have to fill in that interface with something. Air works pretty good, but Silicon Dioxide works a lot better. ( you can also use plain toothpaste with a good effect ). When the interface is sooth from polishing, there is less room for a bridge compound, and thus more coduction of heat takes place between pure materials, glass to copper.
This has been shown in practice for thousands of examples. The closing of microsopic gaps with conductive material ( copper ) improves the heat transfer. Microscopic gaps are NOT closed by thermal expansion, due to the low coefficent of the copper alloy subratate. I do not know the source of your informaiton, but clearly in both disagrees with materials science, and the practice of lapping.
Can you show a few examples of this phenomon? Artoftransformation 19:13, 7 August 2007 (UTC) "Encycloperic content must be verifiable"

I'm not understanding your argument. Are you claiming it's better to have more gaps and more transfer compound or less gaps and less compound? How is glass relevant to this? Ham Pastrami 08:30, 8 August 2007 (UTC)

Its better to have LESS of a GAP, and as a result, less combound. Glass is relevent, because most CPUs are made of silicon, and you have to be extremly carefull when you put the heat sink on. Artoftransformation 09:15, 11 August 2007 (UTC) ( excuse me? your name is Ham Pastrami? Really? )
Rule 1: Provide Refrences:
Please See -> http://reference.techpowerup.com/Thermal_Paste [[1]]
That is fine, but you seem to be agreeing with the comment while having an argumentative tone so it wasn't clear what your position was. My real name is not Ham Pastrami, that is just my user name. :) Ham Pastrami 17:38, 14 August 2007 (UTC)

[edit] Fair use rationale for Image:Pcprobe.png

Image:Pcprobe.png is being used on this article. I notice the image page specifies that the image is being used under fair use but there is no explanation or rationale as to why its use in this Wikipedia article constitutes fair use. In addition to the boilerplate fair use template, you must also write out on the image description page a specific explanation or rationale for why using this image in each article is consistent with fair use.

Please go to the image description page and edit it to include a fair use rationale. Using one of the templates at Wikipedia:Fair use rationale guideline is an easy way to insure that your image is in compliance with Wikipedia policy, but remember that you must complete the template. Do not simply insert a blank template on an image page.

If there is other fair use media, consider checking that you have specified the fair use rationale on the other images used on this page. Note that any fair use images uploaded after 4 May, 2006, and lacking such an explanation will be deleted one week after they have been uploaded, as described on criteria for speedy deletion. If you have any questions please ask them at the Media copyright questions page. Thank you.

BetacommandBot (talk) 18:52, 5 December 2007 (UTC)


[edit] needs more citations or something

There are a lot of statements in here that aren't cited that seem kind of like they should be verified.

Poor airflow (including turbulence) due to friction that reduces the amount of air flowing through a case, possibly causing stable whirlpools of hot air in certain areas.

This seems kind of vague, at least the part about stable whirlpools!

Laptops are typically made to rest on a solid surface. Unfortunately a flat surface is the least desirable angle to dissipate heat, lower temperatures are achieved by a chimney effect when a laptop is set at an angle from horizontal.

How does the 'chimney effect' apply to this? Is it saying that hot air gets trapped under the laptop?

Most older PCs use flat ribbon cables to connect storage drives (IDE or SCSI). These large flat cables greatly impede airflow by causing drag and turbulence. Overclockers and modders often replace these with rounded cables, with the conductive wires bunched together tightly to reduce surface area.

Cylindrical shapes are pretty awful when it comes to drag and turbulence, maybe this was referring to something more specific but I'm not sure what. RadioYeti (talk) 16:14, 23 April 2008 (UTC)