Burn-in ovens
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Burn-in ovens are designed for dynamic and static burn-in of integrated circuits and other electronic devices. Typical sizes are from under ten to over 30 cubic feet, with air or nitrogen configurations. Operating temperatures can go over 260 degrees Celsius ( 500 degrees Fahrenheit), and can use both single and multiple temperature settings.
Burn-in oven applications can be used in numerous different applications such as high-dissipation forward bias, high-temperature reverse bias, dynamic and static burn-in of microprocessors and other semiconductor devices.
Burn-in ovens are considered a type of batch oven. Other types of batch ovens are bench/laboratory, reach in, walk in/truck in, and clean process.
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